Biography
Jincong Lu is a Senior Engineer, RTL at Samsung Semiconductor, Inc., working in the Power & Thermal Lab on thermal modeling, thermal management, and semiconductor design challenges. He received his bachelor's degree from the University of Science and Technology of China in 2018 and his Ph.D. degree in Computer Science and Engineering from the University of California, Riverside in 2026. His research in the VLSI System and Computation Lab (VSCLAB) focused on applying machine learning and scientific computing to chip design problems, including IR drop analysis, thermal prediction, and thermal-aware design optimization.
Work Experience
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Senior Engineer, RTL, Samsung Semiconductor
May 2026-Present, Full-time, San Jose, California
Working in the Power & Thermal Lab on thermal modeling, thermal management, and semiconductor design challenges.
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Technical Engineering Intern, Synopsys Inc
Jun. 2025-Oct. 2025, Internship, Sunnyvale, California
Optimized the application of machine learning algorithms in the EDA workflow.
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Student Intern, NXP Semiconductors
Jun. 2024-Sept. 2024, Internship, Chandler, Arizona
Worked with the Physical Verification Group within the PDK team.
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Student Intern, NXP Semiconductors
Jun. 2023-Sept. 2023, Internship, Remote
Worked with the Physical Verification Group within the PDK team.
Education
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Department of Computer Science and Engineering, University of California, Riverside (UCR)
2020-2026, Ph.D., Major in Computer Science
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Department of Modern Physics, University of Science and Technology of China (USTC)
2014-2018, Bachelor of Science, Major in Theoretical Physics
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School of Computer Science and Technology, USTC
2014-2018, Bachelor of Engineering, Major in Computer Science
Publication List
- Jincong Lu, Jinwei Zhang, Wentian Jin, Sachin Sachdeva, Sheldon Tan, "Learning Based Spatial Power Characterization and Full-Chip Power Estimation for Commercial TPUs", ASP-DAC'23, Jan. 16β19, 2023
- Jincong Lu, Jinwei Zhang, Sheldon Tan, "Real-time Thermal Map Estimation for AMD Multi-Core CPUs Using Transformer", ICCAD'23, Oct. 28 - Nov. 2, 2023
- Liang Chen, Jincong Lu, Wentian Jin, Sheldon Tan, "Fast Full-Chip Parametric Thermal Analysis Based on Enhanced Physics Enforced Neural Networks", ICCAD'23, Oct. 28 - Nov. 2, 2023
- Sachin Sachdeva, Jincong Lu, Hussam Amrouch, Sheldon Tan, "Exploring BTI aging effects on spatial power density and temperature profiles of VLSI chips", Integration, 2024
- Jincong Lu, Sheldon Tan, "Thermal Map Dataset for Commercial Multi/Many Core CPU/GPU/TPU", MLCAD'24, Sept. 9-11, 2024
- Jincong Lu, Sachin Sachdeva, Yuxuan Lin, Sheldon Tan, "Real-time Thermal Map Characterization and Analysis for Commercial GPUs with AI Workloads", ISQED'25, Apr. 23-25, 2025
- Jincong Lu, Sachin Sachdeva, Haotian Lu, Sheldon Tan, "Power Map Characterization and Modeling for Commercial CPU/GPUs Considering Temperature Dependence", ISLPED'25, Aug. 6-8, 2025
- Haotian Lu, Jincong Lu, Shanmukh Racha, Sheldon Tan, "STELLAR-3D: A Structured Thermal- and Warpage-aware LLM-aided Floorplanning Framework for 3D ICs", Accepted by ICLAD'26, July. 30-31, 2026
- Haotian Lu, Jincong Lu, Sachin Sachdeva, Sheldon Tan, "WarPGNN: A Parametric Thermal Warpage Analysis Framework with Physics-aware Graph Neural Network", Accepted by ISLPED'26, Aug. 5-7, 2026
Teaching (as Teaching Assistant, at UCR)
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CS010A: Intro to Computer Science for Science, Mathematics, & Engineering (C++)
2021Fall, 2022Fall
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CS010B: Intro to Computer Science for Science, Mathematics, & Engineering II (C++)
2022Spring
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CS150: Automata and Formal Languages
2023Spring
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CS161L: Laboratory in Design & Architecture of Computer Systems
2023Winter
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EE/CS168: Introduction to Very Large Scale Integration Design
2022Winter